瀏覽次數:71by:美福科技
MSP430F5437IPN
P/N: MSP430F5437IPN
#MSP430F5437I#IC#MCU#TI#Texas#Instruments#TRUSTBAND#現貨商

| P/N: | MSP430F5437IPN | 
| Category | Integrated Circuits (ICs) | 
| Family | Embedded - Microcontrollers | 
| Series | MSP430 | 
| Core Processor | RISC | 
| Core Size | 16-Bit | 
| Speed | 18MHz | 
| Connectivity | I²C, IrDA, LIN, SCI, SPI, UART/USART | 
| Peripherals | Brown-out Detect/Reset, DMA, POR, PWM, WDT | 
| Number of I /O | 67 | 
| Program Memory Size | 256KB (256K x 8) | 
| Program Memory Type | FLASH | 
| EEPROM Size | - | 
| RAM Size | 16K x 8 | 
| Voltage - Supply (Vcc/Vdd) | 2.2 V ~ 3.6 V | 
| Data Converters | A/D 16x12b | 
| Oscillator Type | Internal | 
| Operating Temperature | -40°C ~ 85°C | 
| Package / Case | 80-LQFP | 
| If you have need the stock,please don't hesitate to contact with Trustbond Technology Corp. | |
| Http://www.trustbond.com.tw | |
- 
最新洽詢
 - 
充電器以下型號,請報價
(國**腦*****)#電子零件#充電器#變壓器#充電#電器#電子#智慧#電源供應器 - 
賓士GLC300 AGM80ah 電瓶詢價!
(白*生)#電子#電池#零件#機械#代理#汽車零件#材料 - 
PCB板-DIP加工手焊接-組件組裝
(W**G*****) - 
尋找IC廠商 報價
(洪*騰) - 
詢價代工 開發代餐相關產品
(醫*)#開發#產品 
美福科技
公司位置:新北市-新店區
統一編號:29025439
專司ATMEL,MICROCHIP,Murata,電子零件,BOM LIST電子現貨報價
https://fromm.web66.com.tw/web/NMD?postId=423860STARstretch™ 拉伸膜 纏繞膜 包裝材料
【FROMM 富朗包裝】STARstretch™ 拉伸膜品質越好,成本越低?聽起來好像矛盾,但事實確實如此。如果使用正確的棧板包膜機,在使用拉伸膜纏繞棧板
美福科技產品
- 
MT8377平板晶片
MT8377: 1 GHz Dual-Core Tablet Platform from Mediatek - 
MT8125 - 8389 平板晶片
MT8125 / 8389: Quad-Core Cortex-A7 1.5GHz + CPU Tablet Platform - 
聯發科IC-MT6589
MT6589 Quad-Core Cortex-A7 1GHz+CPU Smartphone Platform - 
聯發科IC-MT6577
MT6577 1GHz Dual-Core Smartphone Platform - 
聯發科IC-MT6573
MT6573 Innovative Platform for Mainstream Smartphones - 
聯發科IC-MT6572
MT6572 First Integrated Platform for Entry Smartphones. - 

BOM 電子零件報價
BOM 電子零件報價:「美福科技股份有限公司」是一家全方位電子零件經銷商,BOM LIST提供24小時內之即時報價服務,我們的報價實在,有競爭性,歡迎詢價。 - 

thick-film resistor,chip res
CR Series Film Resistor: We provide Full size of - 

Thin Film 1Ω~3MΩ
We provide Full size of 0402/0603/0805/1206/2010/2512 - 

X2 Capacitor 0.1-1UF
It's constructed with metalized polypropylene film dielectric, and encapsulated in plastic case.